Reliability degradation of thin HfO2/SiO2 gate stacks by remote RF hydrogen and deuterium plasma treatment

E. Efthymiou, S. Bernardini, J. F. Zhang, S. N. Volkos, B. Hamilton, A. R. Peaker

    Research output: Contribution to journalArticlepeer-review

    Abstract

    Current-voltage measurements indicated that RF hydrogen/deuterium remote plasma treatment of thin p-Si/SiO2/HfO2 structures proved to be detrimental in terms of dielectric reliability. By using capacitance-voltage measurements we demonstrate that this reported degradation was not attributed to plasma-induced defects but rather due to an enhanced liberation of hydrogen and deuterium species during the electrical stress. © 2008 Elsevier B.V. All rights reserved.
    Original languageEnglish
    Pages (from-to)207-208
    Number of pages1
    JournalThin Solid Films
    Volume517
    Issue number1
    DOIs
    Publication statusPublished - 3 Nov 2008

    Keywords

    • Deuterium
    • Dielectric breakdown
    • Hydrogen
    • RF remote plasma
    • SiO2/HfO2 gate stacks

    Fingerprint

    Dive into the research topics of 'Reliability degradation of thin HfO2/SiO2 gate stacks by remote RF hydrogen and deuterium plasma treatment'. Together they form a unique fingerprint.

    Cite this