Abstract
Current-voltage measurements indicated that RF hydrogen/deuterium remote plasma treatment of thin p-Si/SiO2/HfO2 structures proved to be detrimental in terms of dielectric reliability. By using capacitance-voltage measurements we demonstrate that this reported degradation was not attributed to plasma-induced defects but rather due to an enhanced liberation of hydrogen and deuterium species during the electrical stress. © 2008 Elsevier B.V. All rights reserved.
Original language | English |
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Pages (from-to) | 207-208 |
Number of pages | 1 |
Journal | Thin Solid Films |
Volume | 517 |
Issue number | 1 |
DOIs | |
Publication status | Published - 3 Nov 2008 |
Keywords
- Deuterium
- Dielectric breakdown
- Hydrogen
- RF remote plasma
- SiO2/HfO2 gate stacks