Scaleable process for pulsed DC magnetron sputtering of non-conducting oxides

Aluminum and zirconium oxide coatings have been sputter deposited from metal targets using pulsed DC power and partial pressure control. The combination of these techniques enables high rate deposition of oxides and other insulating materials. While pulsed DC power can be used by itself to deposit some oxide materials and control of the reactive gas partial pressure has been very successfully used for the deposition of conductive nitrides, both are required to achieve the highest possible deposition rates and coating repeatability for the deposition of insulating oxides. With the combination of pulsed power and reactive gas pressure control, deposition rates up to 76% and 82% of those for the aluminum and zirconium respectively are achievable.