Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi2Te3nanowires

Daniel Johnson; T. Vincent; Xinyun Liu; B. Gholizadeh; P. Schoenherr; T. Hesjedal; O. Kazakova; Nathaniel  Huang; J. Boland

doi:10.1109/IRMMW-THz57677.2023.10299204

Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi₂Te₃nanowires

Daniel Johnson^*, T. Vincent, Xinyun Liu, B. Gholizadeh, P. Schoenherr, T. Hesjedal, O. Kazakova, Nathaniel Huang, J. Boland

^*Corresponding author for this work

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

Abstract

Topological Insulator (TI) devices have potential applications in spintronic and low-loss communication devices. However, they are difficult to characterize with standard far-field spectroscopy due to contributions from both the surface and the bulk. Utilizing the surface-sensitive scattering type Scanning Nearfield Optical Microscopy (s-SNOM) technique coupled with high surface-to-volume ratio structures such as nanowires, the local dielectric function and electro-optical properties of the metallic surface states of TI candidate Bi2 Te3 are investigated. We demonstrate spectral resonant features at 1250 cm-1, which are imaged with nanoscale resolution.

Original language	English
Title of host publication	IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves
Publisher	IEEE Computer Society
ISBN (Electronic)	9798350336603
DOIs	https://doi.org/10.1109/IRMMW-THz57677.2023.10299204
Publication status	Published - 2023
Event	48th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2023 - Montreal, Canada Duration: 17 Sept 2023 → 22 Sept 2023

Publication series

Name	International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
ISSN (Print)	2162-2027
ISSN (Electronic)	2162-2035

Conference

Conference	48th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2023
Country/Territory	Canada
City	Montreal
Period	17/09/23 → 22/09/23

Access to Document

10.1109/IRMMW-THz57677.2023.10299204

Cite this

Johnson, D., Vincent, T., Liu, X., Gholizadeh, B., Schoenherr, P., Hesjedal, T., Kazakova, O., Huang, N., & Boland, J. (2023). Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi₂Te₃nanowires. In IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz). IEEE Computer Society . https://doi.org/10.1109/IRMMW-THz57677.2023.10299204

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title = "Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi2Te3nanowires",

abstract = "Topological Insulator (TI) devices have potential applications in spintronic and low-loss communication devices. However, they are difficult to characterize with standard far-field spectroscopy due to contributions from both the surface and the bulk. Utilizing the surface-sensitive scattering type Scanning Nearfield Optical Microscopy (s-SNOM) technique coupled with high surface-to-volume ratio structures such as nanowires, the local dielectric function and electro-optical properties of the metallic surface states of TI candidate Bi2 Te3 are investigated. We demonstrate spectral resonant features at 1250 cm-1, which are imaged with nanoscale resolution.",

author = "Daniel Johnson and T. Vincent and Xinyun Liu and B. Gholizadeh and P. Schoenherr and T. Hesjedal and O. Kazakova and Nathaniel Huang and J. Boland",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 48th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2023 ; Conference date: 17-09-2023 Through 22-09-2023",

year = "2023",

doi = "10.1109/IRMMW-THz57677.2023.10299204",

language = "English",

series = "International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz",

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Johnson, D, Vincent, T, Liu, X, Gholizadeh, B, Schoenherr, P, Hesjedal, T, Kazakova, O, Huang, N & Boland, J 2023, Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi₂Te₃nanowires. in IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves. International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, IEEE Computer Society , 48th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2023, Montreal, Canada, 17/09/23. https://doi.org/10.1109/IRMMW-THz57677.2023.10299204

Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi₂Te₃nanowires. / Johnson, Daniel; Vincent, T.; Liu, Xinyun et al.
IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society , 2023. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz).

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

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AU - Johnson, Daniel

AU - Vincent, T.

AU - Liu, Xinyun

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AU - Schoenherr, P.

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AB - Topological Insulator (TI) devices have potential applications in spintronic and low-loss communication devices. However, they are difficult to characterize with standard far-field spectroscopy due to contributions from both the surface and the bulk. Utilizing the surface-sensitive scattering type Scanning Nearfield Optical Microscopy (s-SNOM) technique coupled with high surface-to-volume ratio structures such as nanowires, the local dielectric function and electro-optical properties of the metallic surface states of TI candidate Bi2 Te3 are investigated. We demonstrate spectral resonant features at 1250 cm-1, which are imaged with nanoscale resolution.

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Johnson D, Vincent T, Liu X, Gholizadeh B, Schoenherr P, Hesjedal T et al. Scattering-type Near-Field Optical Microscopy Characterization of Topological Insulator Bi₂Te₃nanowires. In IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society . 2023. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz). doi: 10.1109/IRMMW-THz57677.2023.10299204