Silver assisted crack healing in SiC

Xin Geng; Fan Yang; Yiqiang Chen; Xiaoxiao Lu; Xiangli Zhong; Ping Xiao

doi:10.1016/j.actamat.2015.11.052

Silver assisted crack healing in SiC

Xin Geng, Fan Yang, Yiqiang Chen, Xiaoxiao Lu, Xiangli Zhong, Ping Xiao

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Abstract

This paper provides a potential method through a dissolution-precipitation mechanism to achieve crack healing in SiC by a vacuum heat treatment with Ag at 1450 °C. The thermodynamic calculations and experimental results confirm that the Ag reacts with SiC to form a molten Ag-Si alloy and carbon, which accelerates material transport in SiC, and then by reaction between the Ag-Si and carbon, a new SiC is formed and fills inside the cracks and Vickers indentation impressions to achieve crack healing in SiC. The depth recovery ratio of the indentation is ∼60%. The cracks underneath the indentation break into a row of isolated nodules, which is driven by reducing the interfacial energy between SiC and the Ag-Si alloy.

Original language	English
Pages (from-to)	121-129
Number of pages	9
Journal	Acta Materialia
Volume	105
Issue number	2
Early online date	24 Dec 2015
DOIs	https://doi.org/10.1016/j.actamat.2015.11.052
Publication status	Published - 15 Feb 2016

Keywords

Crack healing
Reprecipitation
Silicon carbide
Silver

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10.1016/j.actamat.2015.11.052

1-s2.0-S1359645415301038-mainFinal published version, 2.46 MB

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title = "Silver assisted crack healing in SiC",

abstract = "This paper provides a potential method through a dissolution-precipitation mechanism to achieve crack healing in SiC by a vacuum heat treatment with Ag at 1450 °C. The thermodynamic calculations and experimental results confirm that the Ag reacts with SiC to form a molten Ag-Si alloy and carbon, which accelerates material transport in SiC, and then by reaction between the Ag-Si and carbon, a new SiC is formed and fills inside the cracks and Vickers indentation impressions to achieve crack healing in SiC. The depth recovery ratio of the indentation is ∼60%. The cracks underneath the indentation break into a row of isolated nodules, which is driven by reducing the interfacial energy between SiC and the Ag-Si alloy.",

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T1 - Silver assisted crack healing in SiC

AU - Geng, Xin

AU - Yang, Fan

AU - Chen, Yiqiang

AU - Lu, Xiaoxiao

AU - Zhong, Xiangli

AU - Xiao, Ping

PY - 2016/2/15

Y1 - 2016/2/15

N2 - This paper provides a potential method through a dissolution-precipitation mechanism to achieve crack healing in SiC by a vacuum heat treatment with Ag at 1450 °C. The thermodynamic calculations and experimental results confirm that the Ag reacts with SiC to form a molten Ag-Si alloy and carbon, which accelerates material transport in SiC, and then by reaction between the Ag-Si and carbon, a new SiC is formed and fills inside the cracks and Vickers indentation impressions to achieve crack healing in SiC. The depth recovery ratio of the indentation is ∼60%. The cracks underneath the indentation break into a row of isolated nodules, which is driven by reducing the interfacial energy between SiC and the Ag-Si alloy.

AB - This paper provides a potential method through a dissolution-precipitation mechanism to achieve crack healing in SiC by a vacuum heat treatment with Ag at 1450 °C. The thermodynamic calculations and experimental results confirm that the Ag reacts with SiC to form a molten Ag-Si alloy and carbon, which accelerates material transport in SiC, and then by reaction between the Ag-Si and carbon, a new SiC is formed and fills inside the cracks and Vickers indentation impressions to achieve crack healing in SiC. The depth recovery ratio of the indentation is ∼60%. The cracks underneath the indentation break into a row of isolated nodules, which is driven by reducing the interfacial energy between SiC and the Ag-Si alloy.

KW - Crack healing

KW - Reprecipitation

KW - Silicon carbide

KW - Silver

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DO - 10.1016/j.actamat.2015.11.052

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JO - Acta Materialia

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Silver assisted crack healing in SiC

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XRADIA : High Resolution of 4D Imaging of Degradation and Self-repair Processes

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Silver assisted crack healing in SiC

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XRADIA : High Resolution of 4D Imaging of Degradation and Self-repair Processes

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