Study of He+-implant isolation of InP/InGaAs HBT structures using TLM

S. C. Subramaniam, A. A. Rezazadeh

    Research output: Contribution to journalArticlepeer-review

    Abstract

    In this paper for the first time we present results of annealing characteristics of He+-ion implant isolation into InP/InGaAs HBT structures. The maximum bombarded Rsh for all emitter, base and collector contact layers occurred at 350 °C. The collector contact had a Rsh of 8 × 104 ω/sq. It was also observed that the existence of built-in electric field in the E/B and B/C junctions could have enhanced the electron hopping for the bombarded emitter and base regions producing greater damage change as compared to the change in Rsh for the collector layer.
    Original languageEnglish
    Pages (from-to)133-136
    Number of pages3
    JournalPhysica Status Solidi (A) Applied Research
    Volume195
    Issue number1
    DOIs
    Publication statusPublished - Jan 2003

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