The influence of precursor on rhenium incorporation into Re-doped MoS2 (Mo1-:XRexS2) thin films by aerosol-assisted chemical vapour deposition (AACVD)

Naktal Al-Dulaimi, Edward Lewis, Nicky Savjani, Paul Mcnaughter, Sarah Haigh, Mohammad Malik, David Lewis, Paul O'Brien

    Research output: Contribution to journalArticlepeer-review

    38 Downloads (Pure)

    Abstract

    The molecular precursors [Mo(S2CNEt2)4] (1), [Re(S2CC6H5)(S3CC6H5)2] (2), and [Re2(μ-S)2(S2CNEt2)4] (3) were used to deposit thin films of Re-doped MoS2 at 550 °C by aerosol assisted chemical vapour Deposition (AACVD). ICP-OES was used to quantify the amount of Re dopant in each film which range from ca. 2-17 at% Re, with greater incorporation of Re from films using precursor (3). In general, lightly doped films show evidence of elemental homogeneity and retention of structure from EDX spectroscopy mapping and p-XRD measurements. However, Raman spectroscopy suggests that the MoS2 structure is lost upon heavy doping (ca. >4-7 at% Re) by the disappearance of the E2g and A1g optical phonons of MoS2, which we attribute to the introduction of intralayer Re-Re bonding caused by the larger 5d orbitals of Re. Electron microscopy shows that inclusion of Re dopant atoms also dramatically influences the morphology of the films produced, ranging from lamellar structures to clusters and florets, though at similar doping level the morphologies are similar for films made from both Re precursors.

    Original languageEnglish
    Pages (from-to)9044-9052
    Number of pages9
    JournalJournal of Materials Chemistry C
    Volume5
    Issue number35
    Early online date2017
    DOIs
    Publication statusPublished - 23 Aug 2017

    Research Beacons, Institutes and Platforms

    • National Graphene Institute

    Fingerprint

    Dive into the research topics of 'The influence of precursor on rhenium incorporation into Re-doped MoS2 (Mo1-:XRexS2) thin films by aerosol-assisted chemical vapour deposition (AACVD)'. Together they form a unique fingerprint.

    Cite this