The mechanism of Fe-rich intermetallic compound formation and growth on inoculants revealed by electron backscattered diraction and X-ray imaging

Shikang Shikang , Zelong Jin, Wenjia Du, Insung Han, Andrew Lui, Xiaorong Zhou, Paul R. Shearing, Patrick S Grant, Enzo Liotti Enzo Liotti

Research output: Contribution to journalArticlepeer-review

Abstract

Fe-rich intermetallics affect critically the mechanical properties and recyclability of aluminium alloys. Increasing effort has been spent on the inoculation of these intermetallics, hoping to promote a finer distribution. Recently Al-5Ti-1B (wt.%), originally developed to rene α-Al, has been shown to rene Al13Fe4, an intermetallic phase present in a variety of Al alloys. However, mechanisms of the formation and growth of the intermetallics on the inoculants are unclear. In this paper, Ti is added to Fe-containing Al alloys to produce a large number of potent Al3Ti particles, the active inoculant in Al-5Ti-1B. We use a combination of electron backscattered diffraction, in situ synchrotron X-ray radiography and post-solidication X-ray computed tomography to investigate the formation and growth of primary Al13Fe4 on Al3Ti inoculants, first in a model Al-Fe alloy, with key insights then confirmed in a high Fe-containing, recycled 6xxx alloy. Crystallographic orientation relationships between Al13Fe4 and Al3Ti are analysed comprehensively, and the formation and growth dynamics of Al13Fe4 on Al3Ti is also unveiled. A strong link is revealed between the formation of Al13Fe4 on Al3Ti and a twinning-related pseudo-symmetry of Al13Fe4. Finally, a potential strategy to rene both intermetallics and α-Al in recycled alloys with elevated Fe concentration is proposed.
Original languageEnglish
Article number112110
JournalMaterials & Design
Volume232
Early online date22 Jun 2023
DOIs
Publication statusPublished - 1 Aug 2023

Keywords

  • Impurity-tolerant alloy design
  • Intermetallic compounds (IMCs)
  • Inoculation
  • Orientation relationships
  • Twinning
  • Alloy recycling

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