Thermal stability of electrodeposited Ni and Ni-Co layers; an EBSD-study

A. A. Rasmussen, A. Gholinia, P. W. Trimby, M. A.J. Somers

Research output: Contribution to journalConference articlepeer-review

Abstract

The influence of heat treatment on the microstructure and the microtexture of electrodeposited Ni and Ni-Co layers was investigated with Electron Backscatter Diffraction (EBSD) with high resolution. Samples were annealed for 1 hour at 523 K and 673 K, the temperature region wherein recrystallisation occurs. The results are discussed in relation to the resolution of EBSD for the very fine grained electrodeposits and previous X-ray diffraction investigations.

Original languageEnglish
Pages (from-to)1345-1352
Number of pages8
JournalMaterials Science Forum
Volume467-470
Issue numberII
Publication statusPublished - 1 Dec 2004
EventProceedings of the Second Joint International Conferences on Recrystallization and Grain Growth, ReX and GG2, SF2M - Annecy, France
Duration: 30 Aug 20043 Sept 2004

Keywords

  • Cobalt
  • EBSD
  • Electrodeposition
  • Microstructure
  • Nickel

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