Thermal stability of electrodeposited Ni and Ni-Co layers; an EBSD-study
- A. A. Rasmussen*
- , A. Gholinia
- , P. W. Trimby
- , M. A.J. Somers
*Corresponding author for this work
- Technical University of Denmark
- HKL TECHNOLOGY A/S
Research output: Contribution to journal › Conference article › peer-review