Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

H. Gjersdal; E. Bolle; M. Borri; C. Da Via; O. Dorholt; S. Fazio; P. Grenier; S. Grinstein; P. Hansson; J. Hasi; F. Hugging; P. Jackson; C. Kenney; M. Kocian; A. La Rosa; A. Mastroberardino; P. Nordahl; F. Rivero; O. Røhne; H. Sandaker; K. Sjøbæk; T. Slaviec; D. Su; J. Tsung; D. Tsybychev; N. Wermes; C. Young

doi:10.1016/j.nima.2010.04.083

Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

H. Gjersdal, E. Bolle, M. Borri, C. Da Via, O. Dorholt, S. Fazio, P. Grenier, S. Grinstein, P. Hansson, J. Hasi, F. Hugging, P. Jackson, C. Kenney, M. Kocian, A. La Rosa, A. Mastroberardino, P. Nordahl, F. Rivero, O. Røhne, H. SandakerK. Sjøbæk, T. Slaviec, D. Su, J. Tsung, D. Tsybychev, N. Wermes, C. Young

Research output: Contribution to journal › Article › peer-review

Abstract

A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the 400μm long pixel side, this resulting in a pn inter-electrode distance of ∼71μm. Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014. © 2010 Elsevier B.V.

Original language	English
Pages (from-to)	S42-S49
Journal	Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment
Volume	636
Issue number	1
DOIs	https://doi.org/10.1016/j.nima.2010.04.083
Publication status	Published - 21 Apr 2011

Keywords

3D pixels
Charge sharing
High energy physics
Radiation hardness
Test beam
Tracking efficiency

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10.1016/j.nima.2010.04.083

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Gjersdal, H., Bolle, E., Borri, M., Da Via, C., Dorholt, O., Fazio, S., Grenier, P., Grinstein, S., Hansson, P., Hasi, J., Hugging, F., Jackson, P., Kenney, C., Kocian, M., La Rosa, A., Mastroberardino, A., Nordahl, P., Rivero, F., Røhne, O., ... Young, C. (2011). Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field. Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment , 636(1), S42-S49. https://doi.org/10.1016/j.nima.2010.04.083

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title = "Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field",

abstract = "A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the 400μm long pixel side, this resulting in a pn inter-electrode distance of ∼71μm. Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014. {\textcopyright} 2010 Elsevier B.V.",

keywords = "3D pixels, Charge sharing, High energy physics, Radiation hardness, Test beam, Tracking efficiency",

author = "H. Gjersdal and E. Bolle and M. Borri and {Da Via}, C. and O. Dorholt and S. Fazio and P. Grenier and S. Grinstein and P. Hansson and J. Hasi and F. Hugging and P. Jackson and C. Kenney and M. Kocian and {La Rosa}, A. and A. Mastroberardino and P. Nordahl and F. Rivero and O. R{\o}hne and H. Sandaker and K. Sj{\o}b{\ae}k and T. Slaviec and D. Su and J. Tsung and D. Tsybychev and N. Wermes and C. Young",

year = "2011",

month = apr,

day = "21",

doi = "10.1016/j.nima.2010.04.083",

language = "English",

volume = "636",

pages = "S42--S49",

journal = "Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment ",

issn = "0168-9002",

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Gjersdal, H, Bolle, E, Borri, M, Da Via, C, Dorholt, O, Fazio, S, Grenier, P, Grinstein, S, Hansson, P, Hasi, J, Hugging, F, Jackson, P, Kenney, C, Kocian, M, La Rosa, A, Mastroberardino, A, Nordahl, P, Rivero, F, Røhne, O, Sandaker, H, Sjøbæk, K, Slaviec, T, Su, D, Tsung, J, Tsybychev, D, Wermes, N & Young, C 2011, 'Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field', Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment , vol. 636, no. 1, pp. S42-S49. https://doi.org/10.1016/j.nima.2010.04.083

Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field. / Gjersdal, H.; Bolle, E.; Borri, M. et al.

In: Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment , Vol. 636, No. 1, 21.04.2011, p. S42-S49.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

AU - Gjersdal, H.

AU - Bolle, E.

AU - Borri, M.

AU - Da Via, C.

AU - Dorholt, O.

AU - Fazio, S.

AU - Grenier, P.

AU - Grinstein, S.

AU - Hansson, P.

AU - Hasi, J.

AU - Hugging, F.

AU - Jackson, P.

AU - Kenney, C.

AU - Kocian, M.

AU - La Rosa, A.

AU - Mastroberardino, A.

AU - Nordahl, P.

AU - Rivero, F.

AU - Røhne, O.

AU - Sandaker, H.

AU - Sjøbæk, K.

AU - Slaviec, T.

AU - Su, D.

AU - Tsung, J.

AU - Tsybychev, D.

AU - Wermes, N.

AU - Young, C.

PY - 2011/4/21

Y1 - 2011/4/21

N2 - A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the 400μm long pixel side, this resulting in a pn inter-electrode distance of ∼71μm. Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014. © 2010 Elsevier B.V.

AB - A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the 400μm long pixel side, this resulting in a pn inter-electrode distance of ∼71μm. Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014. © 2010 Elsevier B.V.

KW - 3D pixels

KW - Charge sharing

KW - High energy physics

KW - Radiation hardness

KW - Test beam

KW - Tracking efficiency

U2 - 10.1016/j.nima.2010.04.083

DO - 10.1016/j.nima.2010.04.083

M3 - Article

VL - 636

SP - S42-S49

JO - Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment

JF - Nuclear Instruments & Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment

SN - 0168-9002

IS - 1

ER -

Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

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Keywords

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