Triple junctions network as the key pattern for characterisation of grain structure evolution in metals

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Abstract

Describing dynamic recrystallisation processes is challenging with the existing limited set of material characterisation tools. This creates potential barriers to further developments in grain boundary engineering. We consider the network of triple junctions in copper alloys as a critical structure governing continuous dynamic recrystallisation and propose a related structural entropy parameter. With the limited available characterisation data we demonstrate that this parameter describes well the evolution of the microstructure during severe plastic deformation. Importantly, with the help of this parameter micro-localisation features in copper alloys observed in some recent experiments can be elucidated.
Original languageEnglish
Article number109352
Number of pages6
JournalMaterials & Design
Volume198
DOIs
Publication statusPublished - 1 Jan 2021

Keywords

  • continuous dynamic recrystallisation
  • high angle grain boundaries
  • triple junctions
  • structural entropy
  • copper alloys
  • severe plastic deformation

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