Abstract
In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials.
Original language | English |
---|---|
Pages (from-to) | 335-341 |
Number of pages | 7 |
Journal | Journal of Materials Engineering and Performance |
Volume | 19 |
Issue number | 3 |
DOIs | |
Publication status | Published - Apr 2010 |
Keywords
- Lead-free solder
- Metal-matrix nanocomposite
- Microwave sintering
- Tensile properties