Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites

S. M. L. Nai, J. V. M. Kuma, M. E. Alam, X. L. Zhong, P. Babaghorbani, M. Gupta

    Research output: Contribution to journalArticlepeer-review

    Abstract

    In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials.
    Original languageEnglish
    Pages (from-to)335-341
    Number of pages7
    JournalJournal of Materials Engineering and Performance
    Volume19
    Issue number3
    DOIs
    Publication statusPublished - Apr 2010

    Keywords

    • Lead-free solder
    • Metal-matrix nanocomposite
    • Microwave sintering
    • Tensile properties

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