Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

M. Gupta*, S. M.L. Nai, J. V.M. Kuma, M. E. Alam, X. L. Zhong, P. Babaghorbani

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructure and mechanical properties of nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition MS and T'08
Pages2641-2651
Number of pages11
Publication statusPublished - 2008
EventMaterials Science and Technology Conference and Exhibition, MS and T'08 - Pittsburgh, PA, United States
Duration: 5 Oct 20089 Oct 2008

Publication series

NameMaterials Science and Technology Conference and Exhibition, MS and T'08
Volume4

Conference

ConferenceMaterials Science and Technology Conference and Exhibition, MS and T'08
Country/TerritoryUnited States
CityPittsburgh, PA
Period5/10/089/10/08

Keywords

  • Lead-free solder
  • Metal-matrix nanocomposite
  • Microwave sintering
  • Tensile properties

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