Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
- M. Gupta*
- , S. M.L. Nai
- , J. V.M. Kuma
- , M. E. Alam
- , X. L. Zhong
- , P. Babaghorbani
*Corresponding author for this work
- National University of Singapore (NUS)
Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review