Vision Sensor with a SIMD Processor Array in a Vertically Stacked 3D Integrated Circuit Technology

P. Dudek, A. Lopich, V. Gruev

    Research output: Chapter in Book/Conference proceedingConference contribution

    Original languageEnglish
    Title of host publicationhost publication
    Publication statusPublished - Mar 2010
    EventWorkshop on 3D integration, Design, Automation and Test in Europe - Dresden
    Duration: 1 Jan 1824 → …

    Conference

    ConferenceWorkshop on 3D integration, Design, Automation and Test in Europe
    CityDresden
    Period1/01/24 → …

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