Coplanar Waveguide (CPW) and Microstrip (MS) transmission line structures using three-dimensional multilayer technology have been designed and fabricated. An analytical model has been developed to predict the characteristic impedance, effective dielectric constant and dissipation loss. These are then used to verify those data from ADS E.M simulator, Momentum. On-wafer measurements and simulation data up to 50 GHz have provided a wide range of impedances from 10 to 70Ω. This work also analyses the attenuation of the CPW line considering conductor and dielectric losses.A novel via-less coplanar waveguide (CPW) to microstrip transition is discussed and the design rules based on simulation and experimental data results are presented. The proposed transition design demonstrates a maximum insertion of 1dB over the frequency range from 7 to 38 GHz and a return loss which is lower than 14 dB from 11 to 66GHz.Fabrication techniques to realise various compact microwave components for low cost applications were employed to lower the cost and simplify the process. A variety of applications of these components could be found due to their compatibility with RF systems on chip, low cost, low loss performance and their ease of fabrication.
|Date of Award||31 Dec 2010|
- The University of Manchester
|Supervisor||Ali Rezazadeh (Supervisor)|